1～2 item / All 2 items
Ideal for semiconductor die attach and interconnection between modules and substrates.
The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.
![[Research Material] Global Market for Epoxy Adhesives](https://image.mono.ipros.com/public/product/image/379/2001467340/IPROS89432718754584855663.jpeg?w=280&h=280)
Global Market for Epoxy Adhesives: Single-component, Two-component, Aerospace & Defense, Automotive, Marine, Electrical & Electronics, Construction, Energy & Power
This research report (Global Epoxy Adhesive Market) investigates and analyzes the current state of the global epoxy adhesive market and its outlook for the next five years. It includes information on the overview of the global epoxy adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on single-component and two-component adhesives, while the segments by application target aerospace & defense, automotive, marine, electrical & electronics, construction, and energy & power. The regional segments calculate the market size of epoxy adhesives by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the epoxy adhesive sector, product and business overviews, and sales performance.
